7.16 3.0um Thick MetalTop Option¶
This section describes the design rules for 3um thick Aluminum MetalTop design rules.
RULE NO. |
DESCRIPTION |
LAYOUT RULE |
Layer |
MT30 = 3um Metal Top |
|
MT30.1 |
|
1.8 2.2 |
MT30.2 |
Min. thick MetalTop space |
1.8 |
MT30.3 |
The separation of two corners should satisfy the minimum spacing |
1.8 |
MT30.4 |
The separation of single metal line from a any degree metal line should satisfy the minimum spacing |
1.8 |
MT30.5 |
Minimum thick MetalTop enclose underlying via (for example: via5 for 6LM case) [Outside Not Allowed] |
0.12 |
MT30.6 |
Thick MetalTop end-of-line (width <2.5um) enclose underlying via (for example: via5 for 6LM case) [Outside Not Allowed] |
0.25 |
MT30.7 |
Thick MetalTop coverage over the entire die shall be >30% (Refer to section 13.0 for Dummy Metal-fill guidelines. Customer needs to Ensure enough dummy metal to satisfy Metaln coverage) |
|
MT30.8a |
As via size compare to min thick-metal width is very small. Single top via (e.g Via3 for 4 layer metal process with 3.0um thick top metal option. in other words via connecting to thick metal) At one location cannot exit under the thick (3um thick) metal. |
DRC check |
MT30.8b |
There shall be minimum 2X2 array of vias (top vias) at one location connecting to 3um thick top metal. Note: This rule will not checked for seal ring area (identified by GUARD_RING_MK As the via rules in this area are separately covered under seal ring section) |
DRC check |