10.10 OTP_MK Mark Layer

This layer is used to mark 3.3V OTP cells. OTP cells with this marking layer should follow below specific rules which is different from 3.3V/(5V)6V rules.

OTP_MK

RULE NO.

DESCRIPTION

LAYOUT RULE

3.3V OTP

5V OTP (1)

O.DF.3a

Min. COMP Space. P-substrate tap (PCOMP outside NWELL) can be butted for different voltage devices as the potential is same

0.24

0.24

O.DF.6

Min. COMP extend beyond poly2 (it also means source/drain overhang)

0.22

0.22

O.DF.9

Min. COMP area (um2)

0.1444

0.1444

O.PL.2

Min. poly2 width

0.22

0.22

O.PL.3a

Min. poly2 Space on COMP

0.18

0.18

O.PL.4

Min. extension beyond COMP to form Poly2 end cap

0.14

0.14

*O.PL.5a

Min. space from field Poly2 to unrelated COMP. Min. space from field Poly2 to Guard-ring.

0

0

*O.PL.5b

Min. space from field Poly2 to related COMP

0

0

O.SB.2

Min. salicide Block Space

0.28

0.28

O.SB.3

Min. space from salicide block to unrelated COMP

0.09

0.09

O.SB.4

Min. space from salicide block to contact

0.03

0.03

*O.SB.5a

Min. space from salicide block to unrelated Poly2 on field

0

0

O.SB.5b

Min. space from salicide block to unrelated Poly2 on COMP

0.1

0*

O.SB.9

Min. salicide block extension beyond unsalicided Poly2

0.1

0.1

O.SB.11

Min. salicide block overlap with COMP

0.04

0.04

*O.SB.12

Min. salicide block overlap with Poly2

0

0

O.SB.13

Min. area of silicide block (um2)

1.488

2

*O.SB.15b

Min. space from unsalicided Poly2 to unrelated Nplus/Pplus along Poly2 Line

0

0

O.CO.7

Min. space from COMP contact to Poly2 on COMP

0.13

0.13

O.PL.ORT

Orientation-restricted gates must have the gate width aligned along the X-axis (poly line running horizontally) in reference to wafer notch down

DRC

NA

Note

* Rules allowed minimum overlap and spacing are 0, so DRC deck will not check those rules 1. Rule of 5V OTP is set by utilizing “V5_XTOR” and “OTP_MK” marking layer

OTP_MK OTP_MK