9.4.5 Probe pad design guidelines¶
Probe pad are the wafer level test pads, which does not require solder bump on it for the packaging. Following are the design guidelines for test probe pad used together with solder bump pad. Probe pads are identified by the PAD layers covered by PROBE_MK layers.
NO. |
DESCRIPTION |
LAYOUT RULE |
PM.1 |
Min PROBE_MK overlap of probe pad passivation opening |
0 |
PM.2 |
Min probe pad passivation opening1 |
50 |
PM.3 |
Min probe pad pitch1 |
80 |
PM.4 |
Min Probe pad top layer metal overlap of pad opening |
2 |
PM.5 |
Min Probe pad passivation opening to solder bump UBM opening |
13 |
This value is subject to respective wafer sort house rule.
