9.1 Bond Pad Rules

This section covers the design rules related to wire-bond and gold bump cases and for solder bump please refer to section 8.0

Bond Pad Rules

RULE NO.

RULE NO. DESCRIPTION

Wedge type Wire bond (without CUP)

Ball type Wire bond (with CUP)

Gold bump

LAYER

Pad

PAD.4

Top layer metal overlap of pad opening

2