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GlobalFoundries GF180MCU PDK 9.4 Guidelines For Solder Bumping Technology
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        • 1.0 Purpose
        • 2.0 Scope
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        • 4.0 Topological Level Definitions
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        • 6.0 Essential Tapeout Checklist
        • 7.0 Layout Rule Description
        • 8.0 Antenna Ratio Rules
          • 9.1 Bond Pad Rules
          • 9.2 Bond Pad Guidelines
          • 9.3 Circuit-Under-Pad (CUP) Rules
            • 9.4.1 Bump Design guidelines
            • 9.4.2 General Information
            • 9.4.3 Solder Bump Pad design guidelines
            • 9.4.4 Alignment Mark for bumping process
            • 9.4.5 Probe pad design guidelines
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        • Appendix A: Device List for Model and LVS Deck
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    9.4 Guidelines For Solder Bumping Technology¶

    The purpose is to outline the basic wafer bumping design rules for GlobalFoundries’ wafers using GlobalFoundries Turn-Key outsource wafer-bumping subcontractor. The scope is all GlobalFoundries wafers designed to be solder bumped for flip chip application.

    • 9.4.1 Bump Design guidelines
    • 9.4.2 General Information
    • 9.4.3 Solder Bump Pad design guidelines
    • 9.4.4 Alignment Mark for bumping process
    • 9.4.5 Probe pad design guidelines
    Previous 9.3 Circuit-Under-Pad (CUP) Rules
    Next 9.4.1 Bump Design guidelines
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