9.4 Guidelines For Solder Bumping Technology

The purpose is to outline the basic wafer bumping design rules for GlobalFoundries’ wafers using GlobalFoundries Turn-Key outsource wafer-bumping subcontractor. The scope is all GlobalFoundries wafers designed to be solder bumped for flip chip application.

• 9.4.1 Bump Design guidelines
• 9.4.2 General Information
• 9.4.3 Solder Bump Pad design guidelines
• 9.4.4 Alignment Mark for bumping process
• 9.4.5 Probe pad design guidelines