3.0 Naming Convention¶
3.1 Cell Naming Convention¶
Digital I/O Cell
Symbol |
Description |
|
Cell Type |
GF |
GF pad cell |
I/O Type |
_in |
Input |
I/O Type |
_bi |
Bidirectional |
Output Type |
_xt |
Tristate with drive strength of x mA |
Analogue Signal Cell
Symbol |
Description |
||
Cell Type |
GF |
GF pad cell |
|
Function |
_asig_5p0 |
Analogue I/O for 5.0V device |
Support Cell
Symbol |
Description |
||
Cell Type |
GF |
GF pad cell |
|
Power |
_dvdd |
DVDD power cell |
|
_dvss |
DVSS ground cell |
||
Corner |
_cor |
Corner cell |
|
Filler |
_fillx |
Filler cell with width = x μm |
|
Filler |
_fillnc |
Filler cell for gap width less than 1μm |
|
Breaker |
_brkx |
Breaker cell with width = x μm |
3.2 Pin Naming Convention¶
Digital I/O Cell
PIN |
Function |
DVDD |
5V supply for output drivers |
VDD |
5V supply for pre-drive in I/O pads |
DVSS |
Ground for output drivers |
VSS |
Ground for pre-drive in I/O pads |
IE |
Input enable |
PD |
Pull-down enable |
PU |
Pull-up enable |
Y |
Data output to core |
PAD |
Data input from/output to bond pad |
OE |
Output enable |
A |
Data input from core |
CS |
CMOS/Schmitt trigger input select |
SL |
Fast/Slow slew rate select |
PDRV0 |
Output drive strength selector |
PDRV1 |
Output drive strength selector |
Analogue Signal Cell
PIN |
Function |
ASIG5V |
5V analogue signal input from/output to core |
PAD |
Data input from/output to bond pad |