2.0 Library Features

2.1 Technology Options

The GlobalFoundries 0.18μm Green 5V I/O library is available in 3LM, 4LM, 5LM metal stack options. The bond pad is non-CUP due to design manual restriction on 3LM. The top metal thickness is available in 6kÅ and 9kA. The design grid used is 0.005μm.

2.2 Cell Dimensions

Pad Cell Name

Height (est.)

Width (est.)

Unit

gf180mcu_fd_io__bi_t

350

75

μm

gf180mcu_fd_io__bi_24t

350

75

μm

gf180mcu_fd_io__in_c

350

75

μm

gf180mcu_fd_io__in_s

350

75

μm

gf180mcu_fd_io__asig_5p0

350

75

μm

gf180mcu_fd_io__dvdd

350

75

μm

gf180mcu_fd_io__dvss

350

75

μm

gf180mcu_fd_io__cor

355

355

μm

gf180mcu_fd_io__fillnc

350

0.1

μm

gf180mcu_fd_io__fill1

350

1

μm

gf180mcu_fd_io__fill5

350

5

μm

gf180mcu_fd_io__fill10

350

10

μm

gf180mcu_fd_io__brk2

350

2

μm

gf180mcu_fd_io__brk5

350

5

μm

The I/O cell height of 350μm (est.) is inclusive of the bonding pad. The bond pad opening is 60μmx60μm.