2.0 Library Features¶
2.1 Technology Options¶
The GlobalFoundries 0.18μm Green 5V I/O library is available in 3LM, 4LM, 5LM metal stack options. The bond pad is non-CUP due to design manual restriction on 3LM. The top metal thickness is available in 6kÅ and 9kA. The design grid used is 0.005μm.
2.2 Cell Dimensions¶
Pad Cell Name |
Height (est.) |
Width (est.) |
Unit |
gf180mcu_fd_io__bi_t |
350 |
75 |
μm |
gf180mcu_fd_io__bi_24t |
350 |
75 |
μm |
gf180mcu_fd_io__in_c |
350 |
75 |
μm |
gf180mcu_fd_io__in_s |
350 |
75 |
μm |
gf180mcu_fd_io__asig_5p0 |
350 |
75 |
μm |
gf180mcu_fd_io__dvdd |
350 |
75 |
μm |
gf180mcu_fd_io__dvss |
350 |
75 |
μm |
gf180mcu_fd_io__cor |
355 |
355 |
μm |
gf180mcu_fd_io__fillnc |
350 |
0.1 |
μm |
gf180mcu_fd_io__fill1 |
350 |
1 |
μm |
gf180mcu_fd_io__fill5 |
350 |
5 |
μm |
gf180mcu_fd_io__fill10 |
350 |
10 |
μm |
gf180mcu_fd_io__brk2 |
350 |
2 |
μm |
gf180mcu_fd_io__brk5 |
350 |
5 |
μm |
The I/O cell height of 350μm (est.) is inclusive of the bonding pad. The bond pad opening is 60μmx60μm.