9.4.3 Solder Bump Pad design guidelines ============================================ This section contains the bumping design guidelines for flip chip applications **Top Metal (Al)** .. csv-table:: Top Metal (Al) :file: tables_clear/31_Top_Metal_76.csv :widths: 100, 700, 100 :align: center .. note:: \* Use tolerance of 0.2um for DRC check. .. image:: images/bump2.png :width: 900 :align: center :alt: TM